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Silver Paste For Higher Square Resistance
MOQ: 500 PCS
Note: If you have any questions,please contact us
- Suitable for higher square resistance, printed on the N surface of the crystalline silicon wafer as the front electrode, and can be co-fired with aluminum paste and silver paste on the back.
- Can be used for lower surface doped emitters ;
- Smoother printing performance to meet the requirements of fine grids ; Broader sintering performance ; Lower single-chip consumption;
- Better contact performance with silicon wafer;
- Cadmium free ; Compatible with PERC process;
Longsun Group Co., Ltd
Since:
1986
Product Description
Features:
1.Suitable for higher square resistance, printed on the N surface of the crystalline silicon wafer as the front electrode, and can be co-fired with aluminum paste and silver paste on the back.
2.Can be used for lower surface doped emitters.
3.Smoother printing performance to meet the requirements of fine grids.
4.Broader sintering performance
5.Lower single-chip consumption
6.Better contact performance with silicon wafer
7.With a larger process adaptation window
8.Compatible with PERC process
9.Cadmium free
Product Description
| Solids(%) | 90-92 |
| Viscosity (Pa·s) | 230-350 |
| Fineness of grind（μm） | |
| Drying | 180–250°C,<3 minutes |
| Firing | 750–800°C, |
| Finger aspect ratio | >0.3 |
| Ribbon of soldering | 60Sn/40Pb, 96.5Sn/3.5Ag，etc. |
| Storage(months,5-25°C) | 6 |